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  this is information on a product in full production. march 2013 docid023113 rev 1 1/9 9 STTH1008DTI 800 v tandem hyperfast diode datasheet ? production data features ? high voltage rectifier ? tandem diodes in series ? very low switching losses ? insulated device with internal ceramic ? equal thermal conditions for both 400 v diodes ? static and dynamic equ ilibrium of internal diodes are warranted by design description the STTH1008DTI is an ultrahigh performance diode composed of two 400 v dice in series. table 1. device summary i f(av) 10 a i frm 20 a v rrm 800 v t rr 40 ns i rm 8.5 a v f 1.7 v t j 150 c to-220ac ins STTH1008DTI a a k k www.st.com
characteristics STTH1008DTI 2/9 docid023113 rev 1 1 characteristics to evaluate the conduction loss es use the following equation: p = 1.65 x i f(av) + 0.04 x i f 2 (rms) table 2. absolute ratings (limiting values per diode at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 800 v i f(rms) forward rms current 16 a i f(av) average forward current, ? = 0.5 t c = 85 c 10 a i frm repetitive peak forward current t c = 135 c, ?? = 0.3 20 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 120 a t stg storage temperature range -65 to +175 c t j maximum junction temperature 150 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2.5 c/w table 4. static electrical characteristics symbol parameters test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 20 a t j = 150 c 20 200 v f (2) forward voltage drop t c = 25 c i f = 10 a 2.15 2.5 v t c = 150 c 1.7 2.05 t c = 25 c i f = 20 a 2.45 2.85 t c = 150 c 2.05 2.45 1. pulse test: t p = 5 ms, ? < 2% 2. pulse test: t p = 380 s, ? < 2%
docid023113 rev 1 3/9 STTH1008DTI characteristics table 5. dynamic electrical characteristics symbol parameters test conditions min. typ max. unit i rm reverse recovery current t j = 125 c i f = 10 a, v r = 400 v, di f /dt = -200 a/s 8.5 11.5 a s factor softness factor 0.8 t rr reverse recovery time t j = 25 c i f = 1 a, v r = 30 v, di f /dt = -50 a/s 40 55 ns t j = 125 c i f = 10 a, v r = 400 v, di f /dt = -200 a/s 80 t fr forward recovery time t j = 25 c i f = 10 a, v fr = 3 v, di f /dt = 100 a/s 180 ns v fp forward recovery voltage t j = 25 c 4.5 7 v figure 1. conduction losses versus average current figure 2. forward voltage drop versus forward current (typical values) p f(av) (w) 0 4 8 12 16 20 24 28 32 0 1 2 3 4 5 6 7 8 9 10 11 12 13 t =tp/t tp i f(av) (a) =0.05 =0.1 =0.2 =0.5 =1 i fm (a) 0.1 1.0 10.0 100.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t j =25 c t j =125 c t j =150 c v fm (v) figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. peak reverse recovery current versus di f /dt (typical values) z t h (j-c) /r t h (j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 single pulse t p (s) i rm (a) 0 2 4 6 8 10 12 14 16 18 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di f /dt(a/s)
characteristics STTH1008DTI 4/9 docid023113 rev 1 figure 5. reverse recovery time versus di f /dt (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) t rr (ns) 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di f /dt(a/s) q rr (nc) 0 100 200 300 400 500 600 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di f /dt(a/s) figure 7. reverse recovery softness factor versus di f /dt (typical values) figure 8. relative variations of dynamic parameters versus junction temperature s fact or 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di f /dt(a/s) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 25 50 75 100 125 i f =i f(av) v r =400 v reference: t j =125 c i rm s factor q rr t j (c) figure 9. transient peak forward voltage versus di f /dt (typical values) figure 10. forward recovery time versus di f /dt (typical values) v fp (v) 0 2 4 6 8 10 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) t j =125 c di f /dt(a/s) t fr (ns) 0 20 40 60 80 100 120 140 100 150 200 250 300 350 400 450 500 i f =i f(av) v fr =3v t j =125 c di f /dt(a/s)
docid023113 rev 1 5/9 STTH1008DTI characteristics figure 11. junction capacitance versus reverse voltage applied (typical values) c(pf) 1 10 100 1 10 100 1000 f=1 mhz v osc =30 mv rms t j =25 c v r (v)
package information STTH1008DTI 6/9 docid023113 rev 1 2 package information ? epoxy meets ul94, v0 ? cooling method: by conduction (c) ? recommended torque: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. to-220ac ins dimension definitions c b2 c2 f ? i l a a1 a2 b e b1 i4 l2 c1 m
docid023113 rev 1 7/9 STTH1008DTI package information table 6. to-220ac ins dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 b 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 c 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 f 6.20 6.60 0.244 0.259 ?i 3.75 3.85 0.147 0.151 i4 15.80 16.40 16.80 0.622 0.646 0.661 l 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 m 2.60 0.102
ordering information STTH1008DTI 8/9 docid023113 rev 1 3 ordering information 4 revision history table 7. ordering information ordering code marking package weight base qty delivery mode STTH1008DTI STTH1008DTI to-220ac insulated 2.3 g 50 tube table 8. document revision history date revision changes 05-mar-2013 1 initial release.
docid023113 rev 1 9/9 STTH1008DTI please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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